Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder
University of Strathclyde · All their open notices
What this is
Supply, delivery, installation and commissioning of a submicron flip-chip die bonder for the National Centre for Advanced Semiconductor Packaging (NCASP) at the University of Strathclyde. The equipment is critical to establishing UK sovereign semiconductor packaging capability for photonics and power electronics applications.
Key points
- Deadline: 4 September 2026 at 12:00 UK time via Public Contracts Scotland portal
- Equipment: Submicron flip-chip die bonder for advanced semiconductor packaging (CPV 38000000)
- Buyer: University of Strathclyde, Glasgow, Scotland (UKM82)
- Scope includes supply, delivery, installation and commissioning
- Open procedure — all qualified suppliers eligible to bid
- Strategic context: Equipment supports UK sovereign semiconductor packaging capability for photonics and power electronics
Who can bid
Open procedure — any qualified supplier may participate
How to submit
Submit via Public Contracts Scotland portal at https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html by 2026-09-04 at 12:00 (UK time)
Classification
CPV 38000000 — Laboratory, optical and precision equipments (excl. glasses) ScotlandGlasgow
Published on Find a Tender. The official notice is the authoritative version.