Supply, Delivery and Installation of Wafer-Level Optical Tester
University of Strathclyde · All their open notices
What this is
Supply, delivery and installation of wafer-level optical tester equipment for the National Centre for Advanced Semiconductor Packaging (NCASP) at the University of Strathclyde. The equipment will perform characterization of DFB laser arrays and silicon photonic integrated circuits to support UK semiconductor packaging capability.
Key points
- Open procedure tender for wafer-level optical tester equipment (CPV 38000000)
- Estimated value GBP 788,000; deadline 7 September 2026 at 12:00 GMT+1
- Equipment must characterize DFB laser arrays and silicon photonic integrated circuits
- Submission via Public Contracts Scotland portal; buyer is University of Strathclyde, Glasgow
- Part of UK National Centre for Advanced Semiconductor Packaging (NCASP) initiative to establish sovereign semiconductor packaging capability
Who can bid
Open procedure — any qualified supplier may participate
How to submit
Submit via Public Contracts Scotland portal: https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html
Classification
CPV 38000000 — Laboratory, optical and precision equipments (excl. glasses) ScotlandGlasgow, Scotland (UKM82)
Published on Find a Tender. The official notice is the authoritative version.