Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment
University of Strathclyde · All their open notices
What this is
The University of Strathclyde is procuring power semiconductor reliability testing equipment for the National Centre for Advanced Semiconductor Packaging (NCASP). Three systems are required: a climatic chamber for high temperature bias testing, a second climatic chamber for high temperature and high humidity bias testing, and a thermal shock test chamber. The equipment is to ensure devices packaged by the facility or its clients meet industry standards, as part of establishing a UK sovereign, open-access advanced semiconductor packaging capability.
Key points
- Three systems: two climatic bias chambers plus a thermal shock chamber
- Supply, delivery and installation for the NCASP scale-up facility
- Equipment must support testing to industry reliability standards
Who can bid
Suppliers of semiconductor reliability test equipment able to supply, deliver and install climatic and thermal shock chambers. No minimum standards are published in this notice.
Classification
CPV 38000000 — Laboratory, optical and precision equipments (excl. glasses) ScotlandGlasgow
Published on Find a Tender. The official notice is the authoritative version.