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Supply, Delivery and Installation of Solder Jetting Equipment

University of Strathclyde · All their open notices

What this is

Supply, delivery and installation of solder jetting equipment for the National Centre for Advanced Semiconductor Packaging (NCASP) in Glasgow, UK. The equipment will process photonic and semiconductor devices for advanced packaging integration to support UK sovereign semiconductor capability.

Key points

Procurement is for solder jetting equipment supply, delivery and installation for advanced semiconductor packaging
Equipment will be used at NCASP facility in Glasgow to process photonic and semiconductor devices
CPV classification: 38000000 (Laboratory, optical and precision equipment)
Procurement category: goods
No threshold conditions, bid bond, deadline, or site tour details provided in the available text

Classification

CPV 38000000 — Laboratory, optical and precision equipments (excl. glasses) ScotlandGlasgow, United Kingdom

Published on Find a Tender. The official notice is the authoritative version.